The next step is to prepare the cooper wires. You need to sprinkle it over the microSD card, and clean it with a scrubbing brush. Now we should remove all traces of flux with the help of alcohol. After heating, all the contacts and the BGA tin will take a semi-sphere form. The BGA flux will help to distribute the heat between all the BGA contacts and melt them carefully. Using a hot air gun, we should heat our pins with the temperature of +200C. When all the BGA balls are melted, you need to put some thick jelly BGA flux on the contacts. Be careful! Perform all the actions gently! For melting, touch the BGA balls with the tip of the soldering iron very quickly. When all the BGA balls are placed on the pins, we should use a soldering iron for melting tin. The liquid flux will help us to fix the BGA balls on the microSD card surface. It’s better to use the BGA balls with the size of ~75% of our contacts diameter. With the help of a wet tooth pick we should place all the BGA balls on the copper pin contacts which are marked on the pinout scheme. We are ready to start the soldering process! 🙂 Make sure there is enough light at your workstation!ĭrop some liquid active flux on the microSD pin contacts with the help of a small brush. You can put the scheme next to you, so that it is at hand when you need to check the pinout array. It would be a good idea to print out the pinout scheme of your monolithic device before soldering. Command contacts: ALE, RE, R/B, CE, CLE, WE įirst, you need to choose the category of your monolithic device (microSD card in our case), and after that you have to choose a compatible pinout ( type 2 in our case).Īfter that, we should fix the microSD card on the Circuit Board adapter for more convenient soldering.To continue working with the monolith, we will need to solder 3 groups of contacts: The next step is searching the pinout in our Global Solution Centre. If you perform all the manipulations correctly, finally you will get something like this: When the first largest part of coating is removed, it is necessary to change the sandpaper to the smaller sand size – 2000.įinally, when the copper layer of contacts becomes visible, we should use the smallest sand size – 2500. We start with the coarse sandpaper (the largest size of sand) – 1000 or 1200. If you damage the pinout layer, data recovery will be impossible! This operation requires some time, so you should be very patient and careful. We need to fix this card on the table with a double-sided adhesive tape.Īfter that, we start to erase the layer of ceramic from the bottom side. When all the equipment is ready for soldering, we can start our process.įirst of all, we take our monolithic device. PC-3000 Flash Circuit Board adapter or Multiboard adapter.Jewellery sandpaper (with the size of 1000, 20 (the bigger is the value – the smaller is the sand)).Copper wires with 0.1 mm diameter with a layer of isolation lacquer.Hot air gun station (for example – Lukey 702).USB soldering iron with a very thin solder tip.A good optic microscope with x2, x4, x8 zoom.For example, you can buy a couple of them just to test your skills of preparing and soldering.īelow you can find the list of necessary equipment: If you never tried to solder monolithic devices before, it’s better to try your skill on some donor devices where data is not important.
32 gb cf card recovery full#
In such cases, the full process of recovery was very simple – we just unsoldered the memory chip, read it in PC-3000 Flash, and made the same preparation as with common USB Flash drives.īut what should we do if our Memory Card, or UFD device is based on monolithic architecture? How can we get access to a NAND memory chip and read data from it?īasically, in this case we should try to find a special technological pinout on the bottom side of our monolithic device by erasing the ceramic layer of coating.īefore you start dealing with monolithic recovery, we should warn you that the complete process of monolithic device soldering is complicated and requires good soldering skills and special equipment. Until recently, all memory cards like SD, Sony MemoryStick, MMC and others, contained a very simple “classic” structure with separated parts – a controller, a PCB and a NAND memory chip in the TSOP-48 or LGA-52 package. Nowadays a lot of modern NAND flash devices use a new type of architecture, where the interface, the controller and memory chips are integrated into one common ceramic layer.
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